松翰5471.TW AI Analysis
TW StockSemiconductor
(No presentation for 5471)
松翰（5471）Dividend Score
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Avg. Yield
5.63%
Avg. Volatility
38.56%
Avg. Filling Rate
72%
Avg. Filling Days
45.33
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.2 | 0 | 2.2 | 5 | 6.97% | 0.84 | 95% |
| 2017 | 1.8 | 0 | 1.8 | 3 | 5.62% | 0.7 | 89% |
| 2018 | 1.5 | 0 | 1.5 | 17 | 5.17% | 0.85 | 89% |
| 2019 | 2.08 | 0 | 2.08 | 25 | 6.91% | 1.01 | 73% |
| 2020 | 2.1 | 0 | 2.1 | 43 | 3.74% | 2.84 | 103% |
| 2021 | 5.7 | 0 | 5.7 | - | 5.68% | 3.97 | 93% |
| 2022 | 7 | 0 | 7 | - | 11.48% | 2.76 | 80% |
| 2023 | 2.5 | 0 | 2.5 | 85 | 5.15% | 0.5 | 73% |
| 2024 | 1.2 | 0 | 1.2 | - | 2.33% | 0.28 | 0% |
| 2025 | 1 | 0 | 1 | 2 | 3.26% | 0.26 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 5
$2.2 (Incl. Stock Dividend $0)
2017 Filling Days: 3
$1.8 (Incl. Stock Dividend $0)
2018 Filling Days: 17
$1.5 (Incl. Stock Dividend $0)
2019 Filling Days: 25
$2.08 (Incl. Stock Dividend $0)
2020 Filling Days: 43
$2.1 (Incl. Stock Dividend $0)