台半5425.TW AI Analysis
TW StockSemiconductor
(No presentation for 5425)
台半（5425）Dividend Score
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Avg. Yield
4.37%
Avg. Volatility
47.66%
Avg. Filling Rate
92%
Avg. Filling Days
18.7
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.5 | 0 | 2.5 | 8 | 6.85% | 1.52 | 78% |
| 2017 | 2.5 | 0 | 2.5 | 5 | 6.3% | 1.61 | 78% |
| 2018 | 2.98 | 0 | 2.98 | 4 | 3.71% | 1.83 | 83% |
| 2019 | 3 | 0 | 3 | 66 | 6% | 1.17 | 89% |
| 2020 | 1.5 | 0 | 1.5 | 34 | 3.87% | 0.87 | 70% |
| 2021 | 1.5 | 0 | 1.5 | 1 | 1.99% | 1.46 | 74% |
| 2022 | 2.5 | 0 | 2.5 | 2 | 3.21% | 3.1 | 75% |
| 2023 | 4 | 0 | 4 | 98 | 4.46% | 1.55 | 67% |
| 2024 | 2 | 0 | 2 | 19 | 3.06% | 0.42 | 73% |
| 2025 | 2.02 | 0 | 2.02 | 13 | 4.25% | 0.64 | 114% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 8
$2.5 (Incl. Stock Dividend $0)
2017 Filling Days: 5
$2.5 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$2.98 (Incl. Stock Dividend $0)
2019 Filling Days: 66
$3 (Incl. Stock Dividend $0)
2020 Filling Days: 34
$1.5 (Incl. Stock Dividend $0)