界霖5285.TW AI Analysis
TW StockSemiconductor
(No presentation for 5285)
界霖（5285）Dividend Score
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Avg. Yield
4.53%
Avg. Volatility
35.41%
Avg. Filling Rate
91.67%
Avg. Filling Days
21.82
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.8 | 0 | 1.8 | 39 | 6.29% | 0.72 | 80% |
| 2017 | 1.55 | 0 | 1.55 | 10 | 3.61% | 1.14 | 80% |
| 2018 | 3.16 | 0 | 3.16 | 4 | 4.07% | 2.41 | 82% |
| 2019 | 3.54 | 0 | 3.54 | 66 | 5.89% | 1.7 | 80% |
| 2020 | 2.46 | 0 | 2.46 | 20 | 5.79% | 0.46 | 34% |
| 2021 | 2.41 | 0 | 2.41 | 1 | 2.13% | 2.74 | 73% |
| 2022 | 4 | 0 | 4 | 4 | 5.41% | 2.81 | 44% |
| 2023 | 3.5 | 0 | 3.5 | 2 | 4.78% | 1.07 | 37% |
| 2024 | 2 | 0 | 2 | 52 | 2.97% | 1.61 | 51% |
| 2025 | 2 | 0 | 2 | 41 | 4.34% | 0.46 | 32% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 39
$1.8 (Incl. Stock Dividend $0)
2017 Filling Days: 10
$1.55 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$3.16 (Incl. Stock Dividend $0)
2019 Filling Days: 66
$3.54 (Incl. Stock Dividend $0)
2020 Filling Days: 20
$2.46 (Incl. Stock Dividend $0)