祥碩5269.TW AI Analysis
TW StockSemiconductor
(No presentation for 5269)
祥碩（5269）Dividend Score
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Avg. Yield
1.61%
Avg. Volatility
51.38%
Avg. Filling Rate
100%
Avg. Filling Days
10.69
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3 | 0 | 3 | 1 | 1.54% | 2.03 | 83% |
| 2017 | 4.5 | 0.05 | 4.55 | 7 | 1.44% | 1.76 | 73% |
| 2018 | 6 | 0 | 6 | 1 | 1.38% | 6.03 | 83% |
| 2019 | 12 | 0 | 12 | 2 | 2.21% | 8.01 | 75% |
| 2020 | 11.97 | 0 | 11.97 | 1 | 0.68% | 20.7 | 86% |
| 2021 | 24 | 0 | 24 | 3 | 1.24% | 21.38 | 57% |
| 2022 | 26 | 0 | 26 | 1 | 2.78% | 22.54 | 56% |
| 2023 | 20 | 0 | 20 | 2 | 2.08% | 12.71 | 53% |
| 2024 | 18.58 | 0 | 18.58 | 1 | 1.13% | 25.97 | 53% |
| 2025 | 30 | 0 | 30 | 1 | 1.62% | 31.41 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$3 (Incl. Stock Dividend $0)
2017 Filling Days: 7
$4.5 (Incl. Stock Dividend $0.052)
2018 Filling Days: 1
$6 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$12 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$11.97 (Incl. Stock Dividend $0)