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全訊5222.TW AI Analysis

TW StockSemiconductor
(No presentation for 5222)

全訊(5222)Dividend Score

Oriented Analysis

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全訊(5222)Dividend Reference Factor

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Avg. Yield

2.38%

Avg. Volatility

40.85%

Avg. Filling Rate

85.71%

Avg. Filling Days

21.33

Consequent Years

4

Historical Dividend Policy

YearCash DividendStock DividendTotalFilling DaysDividend YieldEPSPayout Ratio
20223.503.51152.21%0.8690%
202330.13.121.76%1.6981%
202440.14.112.45%1.7568%
202540.14.143.1%1.1182%

Dividend Distribution and Dividend Yield

2022 Filling Days: 115

$3.5 (Incl. Stock Dividend $0)

2.21%

2023 Filling Days: 2

$3 (Incl. Stock Dividend $0.1)

1.76%

2024 Filling Days: 1

$4 (Incl. Stock Dividend $0.1)

2.45%

2025 Filling Days: 4

$4 (Incl. Stock Dividend $0.1)

3.1%