廣穎4973.TW AI Analysis
TW StockSemiconductor
(No presentation for 4973)
廣穎（4973）Dividend Score
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Avg. Yield
5.76%
Avg. Volatility
58.59%
Avg. Filling Rate
92.31%
Avg. Filling Days
50.83
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.2 | 0 | 1.2 | 9 | 4.82% | 1.15 | 147% |
| 2017 | 1.8 | 0 | 1.8 | 23 | 9.55% | 0.1 | 86% |
| 2018 | 1 | 0 | 1 | 174 | 6.49% | -0.83 | 371% |
| 2019 | 1.2 | 0 | 1.2 | 15 | 7.1% | 0.42 | 90% |
| 2020 | 1.2 | 0 | 1.2 | 6 | 4.67% | 0.95 | 80% |
| 2021 | 1 | 0 | 1 | 7 | 3.79% | 0.22 | 87% |
| 2022 | 1 | 0 | 1 | 171 | 4.3% | 0.26 | 282% |
| 2023 | 2 | 0 | 2 | 33 | 7.35% | 0.38 | 69% |
| 2024 | 2 | 0 | 2 | 11 | 5.29% | 1.41 | 65% |
| 2025 | 1 | 0 | 1 | 2 | 4.25% | -0.03 | 58% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 9
$1.2 (Incl. Stock Dividend $0)
2017 Filling Days: 23
$1.8 (Incl. Stock Dividend $0)
2018 Filling Days: 174
$1 (Incl. Stock Dividend $0)
2019 Filling Days: 15
$1.2 (Incl. Stock Dividend $0)
2020 Filling Days: 6
$1.2 (Incl. Stock Dividend $0)