天鈺4961.TW AI Analysis
TW StockSemiconductor
(No presentation for 4961)
天鈺（4961）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2019 | 1.3 | 0 | 1.3 | 1 | 3.3% | 1.08 | 61% |
| 2020 | 1 | 0 | 1 | 1 | 3.21% | 0.66 | 54% |
| 2021 | 2.5 | 0 | 2.5 | 1 | 0.79% | 15.35 | 62% |
| 2022 | 17 | 0 | 17 | 11 | 14.98% | 12.14 | 54% |
| 2023 | 8.5 | 0 | 8.5 | 24 | 6.01% | 5.39 | 52% |
| 2024 | 10.64 | 0 | 10.64 | 1 | 3.98% | 8.08 | 0% |
| 2025 | 12.87 | 0 | 12.87 | - | 6.26% | 5.88 | 0% |
Dividend Distribution and Dividend Yield
2019 Filling Days: 1
$1.3 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1 (Incl. Stock Dividend $0)
2021 Filling Days: 1
$2.5 (Incl. Stock Dividend $0)
2022 Filling Days: 11
$17 (Incl. Stock Dividend $0)
2023 Filling Days: 24
$8.5 (Incl. Stock Dividend $0)
Avg. Yield
5.5%
Avg. Volatility
35.65%
Avg. Filling Rate
85.71%
Avg. Filling Days
6.5
Consequent Years
7