家登3680.TW AI Analysis
TW StockSemiconductor
(No presentation for 3680)
家登(3680)Dividend Score

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Avg. Yield
1.39%
Avg. Volatility
48.4%
Avg. Filling Rate
100%
Avg. Filling Days
12.48
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.51 | 0 | 0.51 | 20 | 1.6% | -0.32 | 287% |
| 2017 | 0.37 | 0 | 0.37 | 5 | 1.15% | 0.04 | 80% |
| 2018 | 0.25 | 0 | 0.25 | 1 | 0.78% | -1.03 | 104% |
| 2019 | 0.25 | 0 | 0.25 | 1 | 0.35% | 1.85 | 93% |
| 2020 | 2.03 | 0 | 2.03 | 18 | 1% | 0.96 | 67% |
| 2021 | 4.86 | 0 | 4.86 | 1 | 1.67% | 0.63 | 88% |
| 2022 | 2.8 | 0 | 2.8 | 1 | 0.99% | 4.87 | 70% |
| 2023 | 7.94 | 0 | 7.94 | 2 | 2.38% | 8.36 | 73% |
| 2024 | 7.51 | 0 | 7.51 | 2 | 1.91% | 6.24 | 78% |
| 2025 | 8.9 | 0 | 8.9 | 6 | 2.07% | 7.48 | 73% |
| 2026 | 1.9 | 0 | 1.9 | 1 | 0.56% | 4.2 | 73% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 20
$0.51 (Incl. Stock Dividend $0)
2017 Filling Days: 5
$0.37 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.25 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$0.25 (Incl. Stock Dividend $0)
2020 Filling Days: 18
$2.03 (Incl. Stock Dividend $0)