德微3675.TW AI Analysis
TW StockSemiconductor
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德微（3675）Dividend Score
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Avg. Yield
3.08%
Avg. Volatility
55.74%
Avg. Filling Rate
100%
Avg. Filling Days
20.58
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.63 | 0 | 0.63 | 2 | 2.59% | 1.01 | 30% |
| 2017 | 3.46 | 0 | 3.46 | 28 | 6.7% | 2.28 | 157% |
| 2018 | 2 | 0 | 2 | 1 | 4.25% | 1.21 | 67% |
| 2019 | 2 | 0 | 2 | 13 | 4.9% | 1.1 | 79% |
| 2020 | 1.3 | 0 | 1.3 | 1 | 1.98% | 1.31 | 57% |
| 2021 | 2 | 0 | 2 | 1 | 1.18% | 5.12 | 95% |
| 2022 | 5 | 0 | 5 | 19 | 2.35% | 8.01 | 68% |
| 2023 | 5.4 | 0.13 | 5.53 | 68 | 1.94% | 4.61 | 53% |
| 2024 | 5 | 0 | 5 | 1 | 1.45% | 4.4 | 0% |
| 2025 | 5.15 | 0 | 5.15 | 43 | 3.48% | 0.48 | 62% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 2
$0.63 (Incl. Stock Dividend $0)
2017 Filling Days: 28
$3.46 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$2 (Incl. Stock Dividend $0)
2019 Filling Days: 13
$2 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1.3 (Incl. Stock Dividend $0)