通嘉3588.TW AI Analysis
TW StockSemiconductor
(No presentation for 3588)
通嘉（3588）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.5 | 0 | 1.5 | 21 | 5.09% | 0.94 | 47% |
| 2017 | 1.5 | 0 | 1.5 | 4 | 5.69% | 0.09 | 46% |
| 2018 | 0.5 | 0 | 0.5 | 2 | 1.99% | 0.49 | 106% |
| 2019 | 0.75 | 0 | 0.75 | 3 | 3.27% | 0.1 | 63% |
| 2020 | 1 | 0 | 1 | 2 | 2.83% | 0.35 | 90% |
| 2021 | 0.6 | 0.1 | 0.7 | 41 | 0.45% | 4.14 | 48% |
| 2022 | 3.3 | 0.07 | 3.37 | - | 4.68% | 2.7 | 45% |
| 2023 | 0.91 | 0.03 | 0.94 | 5 | 1.9% | -0.52 | 21% |
| 2024 | 0.4 | 0.02 | 0.42 | 1 | 0.45% | 0.18 | 0% |
| 2025 | 1.2 | 0.02 | 1.22 | 5 | 2.8% | 0.29 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 21
$1.5 (Incl. Stock Dividend $0)
2017 Filling Days: 4
$1.5 (Incl. Stock Dividend $0)
2018 Filling Days: 2
$0.5 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$0.75 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$1 (Incl. Stock Dividend $0)
Avg. Yield
2.92%
Avg. Volatility
45.77%
Avg. Filling Rate
81.25%
Avg. Filling Days
7.69
Consequent Years
10