辛耘3583.TW AI Analysis
TW StockSemiconductor
(No presentation for 3583)
辛耘（3583）Dividend Score
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Avg. Yield
2.63%
Avg. Volatility
45.88%
Avg. Filling Rate
100%
Avg. Filling Days
6.69
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1 | 0 | 1 | 1 | 1.46% | 2.01 | 95% |
| 2017 | 2.02 | 0 | 2.02 | 1 | 3.28% | 1.12 | 56% |
| 2018 | 2 | 0 | 2 | 2 | 2.44% | 1.41 | 49% |
| 2019 | 2.5 | 0 | 2.5 | 5 | 3.97% | 2.4 | 48% |
| 2020 | 2 | 0 | 2 | 11 | 4.23% | 1.32 | 50% |
| 2021 | 1.85 | 0 | 1.85 | 3 | 2.92% | 2.08 | 49% |
| 2022 | 2.5 | 0 | 2.5 | 40 | 3.29% | 3.4 | 48% |
| 2023 | 3.6 | 0 | 3.6 | 2 | 2.28% | 3.73 | 51% |
| 2024 | 4 | 0 | 4 | 1 | 1.14% | 5.43 | 49% |
| 2025 | 4.5 | 0 | 4.5 | 2 | 1.29% | 6.05 | 39% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$1 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$2.02 (Incl. Stock Dividend $0)
2018 Filling Days: 2
$2 (Incl. Stock Dividend $0)
2019 Filling Days: 5
$2.5 (Incl. Stock Dividend $0)
2020 Filling Days: 11
$2 (Incl. Stock Dividend $0)