博磊3581.TW AI Analysis
TW StockSemiconductor
(No presentation for 3581)
博磊（3581）Dividend Score
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Avg. Yield
3.86%
Avg. Volatility
67.87%
Avg. Filling Rate
100%
Avg. Filling Days
20.73
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1 | 0 | 1 | 128 | 5.71% | 0.48 | 88% |
| 2017 | 1 | 0 | 1 | 1 | 5.03% | 0.3 | 90% |
| 2018 | 1 | 0 | 1 | 11 | 4.33% | 0.46 | 67% |
| 2019 | 0.7 | 0 | 0.7 | 42 | 4.73% | 0.49 | 98% |
| 2020 | 0.7 | 0 | 0.7 | 7 | 4.75% | 0.79 | 66% |
| 2021 | 0.9 | 0 | 0.9 | 1 | 3.48% | 0.99 | 60% |
| 2022 | 1 | 0 | 1 | 8 | 4.87% | 0.32 | 47% |
| 2023 | 0.8 | 0 | 0.8 | 1 | 3.38% | 0.3 | 64% |
| 2024 | 0.5 | 0 | 0.5 | 6 | 0.97% | 0.18 | 91% |
| 2025 | 0.5 | 0 | 0.5 | 1 | 1.39% | -0.6 | 83% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 128
$1 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$1 (Incl. Stock Dividend $0)
2018 Filling Days: 11
$1 (Incl. Stock Dividend $0)
2019 Filling Days: 42
$0.7 (Incl. Stock Dividend $0)
2020 Filling Days: 7
$0.7 (Incl. Stock Dividend $0)