逸昌3567.TW AI Analysis
TW StockSemiconductor
(No presentation for 3567)
逸昌（3567）Dividend Score
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Avg. Yield
7.25%
Avg. Volatility
32.11%
Avg. Filling Rate
80%
Avg. Filling Days
47.92
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.1 | 0 | 1.1 | 11 | 6.92% | 0.8 | 89% |
| 2017 | 2 | 0 | 2 | 57 | 7.63% | 1.3 | 82% |
| 2018 | 2.3 | 0 | 2.3 | - | 7.28% | 1.31 | 83% |
| 2019 | 2 | 0 | 2 | 151 | 8.37% | 0.75 | 73% |
| 2020 | 1.71 | 0 | 1.71 | 86 | 6.68% | 1.07 | 94% |
| 2021 | 2 | 0 | 2 | 5 | 5.74% | 1.32 | 85% |
| 2022 | 2.6 | 0 | 2.6 | 177 | 9.2% | 1.6 | 84% |
| 2023 | 2.1 | 0 | 2.1 | 8 | 7.08% | 1.23 | 89% |
| 2024 | 2.7 | 0 | 2.7 | - | 6.66% | 1 | 90% |
| 2025 | 1.8 | 0 | 1.8 | 52 | 6.91% | 0.38 | 96% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 11
$1.1 (Incl. Stock Dividend $0)
2017 Filling Days: 57
$2 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$2.3 (Incl. Stock Dividend $0)
2019 Filling Days: 151
$2 (Incl. Stock Dividend $0)
2020 Filling Days: 86
$1.71 (Incl. Stock Dividend $0)