禾瑞亞3556.TW AI Analysis
TW StockSemiconductor
(No presentation for 3556)
禾瑞亞（3556）Dividend Score
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Avg. Yield
6.19%
Avg. Volatility
32.31%
Avg. Filling Rate
77.78%
Avg. Filling Days
67.57
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3.7 | 0.04 | 3.74 | - | 7.23% | 1.84 | 90% |
| 2017 | 3.7 | 0.04 | 3.74 | 91 | 7.5% | 1.87 | 90% |
| 2018 | 4.1 | 0 | 4.1 | - | 8.32% | 1.56 | 88% |
| 2019 | 3.3 | 0 | 3.3 | 186 | 6.86% | 2.04 | 90% |
| 2020 | 3.3 | 0 | 3.3 | 142 | 5.4% | 2.34 | 91% |
| 2021 | 3.15 | 0.03 | 3.18 | 6 | 3.6% | 3.27 | 81% |
| 2022 | 5 | 0.04 | 5.04 | 166 | 8.23% | 3.74 | 82% |
| 2023 | 4.7 | 0 | 4.7 | - | 7.52% | 1.99 | 92% |
| 2024 | 0.9 | 0 | 0.9 | 3 | 1.72% | 1.47 | 93% |
| 2025 | 2.08 | 0 | 2.08 | 56 | 5.51% | 0.84 | 91% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$3.7 (Incl. Stock Dividend $0.04)
2017 Filling Days: 91
$3.7 (Incl. Stock Dividend $0.04)
2018 Filling Days: 0
$4.1 (Incl. Stock Dividend $0)
2019 Filling Days: 186
$3.3 (Incl. Stock Dividend $0)
2020 Filling Days: 142
$3.3 (Incl. Stock Dividend $0)