敦泰3545.TW AI Analysis
TW StockSemiconductor
(No presentation for 3545)
敦泰(3545)Dividend Score

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Avg. Yield
3.56%
Avg. Volatility
36.99%
Avg. Filling Rate
88.89%
Avg. Filling Days
7.44
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.73 | 0 | 0.73 | 2 | 2.32% | -0.1 | 84% |
| 2017 | 0.66 | 0 | 0.66 | 1 | 1.67% | 0.11 | 90% |
| 2018 | 0.51 | 0 | 0.51 | 3 | 2.05% | 0.36 | 0% |
| 2019 | 0.52 | 0 | 0.52 | 1 | 2.25% | -1.13 | 0% |
| 2020 | 0.5 | 0 | 0.5 | 1 | 1.44% | 0.62 | 0% |
| 2021 | 3.23 | 0 | 3.23 | 44 | 1.87% | 23.73 | 69% |
| 2022 | 15.84 | 0 | 15.84 | - | 19.58% | 4.02 | 56% |
| 2023 | 0.5 | 0 | 0.5 | 1 | 0.65% | 0.76 | 0% |
| 2024 | 1 | 0 | 1 | 1 | 1.18% | 0.54 | 60% |
| 2025 | 1.74 | 0 | 1.74 | 1 | 2.63% | 1.55 | 66% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 2
$0.73 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$0.66 (Incl. Stock Dividend $0)
2018 Filling Days: 3
$0.51 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$0.52 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)