力旺3529.TW AI Analysis
TW StockSemiconductor
(No presentation for 3529)
力旺(3529)Dividend Score

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Avg. Yield
1.34%
Avg. Volatility
59.47%
Avg. Filling Rate
100%
Avg. Filling Days
16.87
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 6 | 0 | 6 | 12 | 1.9% | 3.59 | 90% |
| 2017 | 6.5 | 0 | 6.5 | 11 | 1.65% | 3.79 | 82% |
| 2018 | 7.5 | 0 | 7.5 | 194 | 1.99% | 3.71 | 90% |
| 2019 | 8 | 0 | 8 | 1 | 2.07% | 3.94 | 91% |
| 2020 | 7 | 0 | 7 | 1 | 1.35% | 4.66 | 75% |
| 2021 | 9 | 0 | 9 | 1 | 0.61% | 7.2 | 79% |
| 2022 | 14 | 0 | 14 | 15 | 1.22% | 10.39 | 85% |
| 2023 | 20.5 | 0 | 20.5 | 1 | 0.99% | 8.91 | 88% |
| 2024 | 17.5 | 0 | 17.5 | 1 | 0.69% | 12.13 | 89% |
| 2025 | 22 | 0 | 22 | 1 | 0.91% | 11.54 | 90% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 12
$6 (Incl. Stock Dividend $0)
2017 Filling Days: 11
$6.5 (Incl. Stock Dividend $0)
2018 Filling Days: 194
$7.5 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$8 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$7 (Incl. Stock Dividend $0)