聚積3527.TW AI Analysis
TW StockSemiconductor
(No presentation for 3527)
聚積(3527)Dividend Score

Browsing restrictions can be lifted for a fee.

Browsing restrictions can be lifted for a fee.
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3.5 | 0 | 3.5 | 76 | 4.93% | 3.21 | 71% |
| 2017 | 3.5 | 0.05 | 3.55 | 47 | 5.74% | 1.3 | 59% |
| 2018 | 2.27 | 0.05 | 2.31 | 9 | 2.1% | 5.65 | 62% |
| 2019 | 5 | 0 | 5 | 42 | 4.13% | 4 | 76% |
| 2020 | 4.15 | 0 | 4.15 | 15 | 4.69% | 0.81 | 80% |
| 2021 | 2 | 0 | 2 | 1 | 0.82% | 3.55 | 131% |
| 2022 | 8 | 0 | 8 | 18 | 7.27% | 6.02 | 63% |
| 2023 | 4 | 0 | 4 | 59 | 4.12% | -0.43 | 62% |
| 2024 | 2 | 0 | 2 | 1 | 2.33% | 0.13 | -720% |
| 2025 | 2 | 0 | 2 | 24 | 3.08% | -0.9 | 703% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 76
$3.5 (Incl. Stock Dividend $0)
2017 Filling Days: 47
$3.5 (Incl. Stock Dividend $0.05)
2018 Filling Days: 9
$2.27 (Incl. Stock Dividend $0.0453765)
2019 Filling Days: 42
$5 (Incl. Stock Dividend $0)
2020 Filling Days: 15
$4.15 (Incl. Stock Dividend $0)
Avg. Yield
3.92%
Avg. Volatility
41.56%
Avg. Filling Rate
100%
Avg. Filling Days
39.28
Consequent Years
10