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台灣精材3467.TW AI Analysis

TW StockSemiconductor
(No presentation for 3467)

台灣精材（3467）Dividend Score

Oriented Analysis

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台灣精材（3467）Dividend Reference Factor

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Historical Dividend Policy

YearCash DividendStock DividendTotalFilling DaysDividend YieldEPSPayout Ratio
20250.8200.8251.37%0.2388%

Dividend Distribution and Dividend Yield

2025 Filling Days: 5

$0.82 (Incl. Stock Dividend $0)

1.37%

Avg. Yield

1.37%

Avg. Volatility

63.67%

Avg. Filling Rate

100%

Avg. Filling Days

5

Consequent Years

1