聯鈞3450.TW AI Analysis
TW StockSemiconductor
(No presentation for 3450)
聯鈞（3450）Dividend Score
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Browsing restrictions can be lifted for a fee.
Avg. Yield
2.95%
Avg. Volatility
58.32%
Avg. Filling Rate
78.95%
Avg. Filling Days
28.33
Consequent Years
1
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 6.5 | 0.2 | 6.7 | 145 | 5.29% | 5.84 | 52% |
| 2017 | 6.5 | 0.2 | 6.7 | - | 5.67% | 2.52 | 60% |
| 2018 | 3 | 0.1 | 3.1 | - | 3.17% | 2.35 | 53% |
| 2019 | 3 | 0 | 3 | 37 | 5.28% | 0.83 | 73% |
| 2020 | 1 | 0 | 1 | - | 1.29% | 1.01 | 61% |
| 2021 | 1.4 | 0 | 1.4 | 6 | 2.68% | 1.37 | 85% |
| 2022 | 1.8 | 0 | 1.8 | 4 | 4.53% | 0.94 | 71% |
| 2023 | 0.5 | 0 | 0.5 | 3 | 1.35% | -0.37 | 38% |
| 2024 | 0 | 0 | 0 | - | 0% | - | - |
| 2025 | 0.5 | 0 | 0.5 | 2 | 0.23% | 2.87 | 13% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 145
$6.5 (Incl. Stock Dividend $0.2)
2017 Filling Days: 0
$6.5 (Incl. Stock Dividend $0.2)
2018 Filling Days: 0
$3 (Incl. Stock Dividend $0.1)
2019 Filling Days: 37
$3 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$1 (Incl. Stock Dividend $0)