京鼎3413.TW AI Analysis
TW StockSemiconductor
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京鼎（3413）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 4 | 0 | 4 | 25 | 5.46% | 3.17 | 53% |
| 2017 | 4 | 0.05 | 4.05 | 3 | 2.44% | 6.58 | 47% |
| 2018 | 6 | 0.05 | 6.05 | - | 3.41% | 7.34 | 44% |
| 2019 | 7 | 0 | 7 | 59 | 5.67% | 2.44 | 50% |
| 2020 | 4 | 0 | 4 | 1 | 2.04% | 7.54 | 51% |
| 2021 | 6.98 | 0 | 6.98 | 1 | 3.35% | 8.03 | 50% |
| 2022 | 8.69 | 0 | 8.69 | 15 | 4.73% | 12.2 | 56% |
| 2023 | 13.79 | 0 | 13.79 | 113 | 7.33% | 10.42 | 58% |
| 2024 | 11.3 | 0 | 11.3 | 5 | 3.61% | 5.52 | 59% |
| 2025 | 14.42 | 0 | 14.42 | 3 | 5.01% | 10.11 | 60% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 25
$4 (Incl. Stock Dividend $0)
2017 Filling Days: 3
$4 (Incl. Stock Dividend $0.05)
2018 Filling Days: 0
$6 (Incl. Stock Dividend $0.05)
2019 Filling Days: 59
$7 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$4 (Incl. Stock Dividend $0)
Avg. Yield
4.3%
Avg. Volatility
40.34%
Avg. Filling Rate
90%
Avg. Filling Days
25
Consequent Years
10