台星科3265.TW AI Analysis
TW StockSemiconductor
(No presentation for 3265)
台星科（3265）Dividend Score
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Avg. Yield
4.52%
Avg. Volatility
42.91%
Avg. Filling Rate
85%
Avg. Filling Days
26.71
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.25 | 0 | 0.25 | 1 | 1.15% | 0.13 | -21% |
| 2017 | 0.85 | 0 | 0.85 | 78 | 3.6% | 1.15 | 19% |
| 2018 | 1.3 | 0 | 1.3 | 15 | 4.41% | 1.4 | 24% |
| 2019 | 1.2 | 0 | 1.2 | 6 | 5.04% | 0.33 | 50% |
| 2020 | 1.5 | 0 | 1.5 | 78 | 6.25% | 0.28 | 36% |
| 2021 | 1.23 | 0 | 1.23 | 3 | 4.31% | 1.01 | 80% |
| 2022 | 2.3 | 0 | 2.3 | 5 | 5.3% | 3.97 | 80% |
| 2023 | 5 | 0 | 5 | 4 | 6.77% | 3.22 | 74% |
| 2024 | 4.8 | 0 | 4.8 | - | 3.6% | 3.4 | 78% |
| 2025 | 4.6 | 0 | 4.6 | 9 | 4.8% | 2.2 | 74% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.25 (Incl. Stock Dividend $0)
2017 Filling Days: 78
$0.85 (Incl. Stock Dividend $0)
2018 Filling Days: 15
$1.3 (Incl. Stock Dividend $0)
2019 Filling Days: 6
$1.2 (Incl. Stock Dividend $0)
2020 Filling Days: 78
$1.5 (Incl. Stock Dividend $0)