欣銓3264.TW AI Analysis
TW StockSemiconductor
(No presentation for 3264)
欣銓（3264）Dividend Score
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Avg. Yield
5%
Avg. Volatility
49.32%
Avg. Filling Rate
80.95%
Avg. Filling Days
32.41
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.3 | 0.01 | 1.31 | 3 | 6.11% | 0.72 | 63% |
| 2017 | 1.25 | 0 | 1.25 | 3 | 4.47% | 1.03 | 68% |
| 2018 | 1.65 | 0 | 1.65 | 8 | 4.52% | 1.43 | 63% |
| 2019 | 1.6 | 0 | 1.6 | 82 | 5.67% | 0.94 | 51% |
| 2020 | 1.3 | 0 | 1.3 | 14 | 4.13% | 1.65 | 57% |
| 2021 | 2 | 0 | 2 | - | 3.21% | 4.01 | 55% |
| 2022 | 2.8 | 0 | 2.8 | 108 | 5.96% | 3.25 | 53% |
| 2023 | 3.5 | 0 | 3.5 | 54 | 5.65% | 2.73 | 41% |
| 2024 | 3.3 | 0 | 3.3 | 145 | 4.73% | 2.32 | 45% |
| 2025 | 4 | 0 | 4 | 1 | 5.55% | 2.46 | 93% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 3
$1.3 (Incl. Stock Dividend $0.0100023)
2017 Filling Days: 3
$1.25 (Incl. Stock Dividend $0)
2018 Filling Days: 8
$1.65 (Incl. Stock Dividend $0)
2019 Filling Days: 82
$1.6 (Incl. Stock Dividend $0)
2020 Filling Days: 14
$1.3 (Incl. Stock Dividend $0)