威剛3260.TW AI Analysis
TW StockSemiconductor
(No presentation for 3260)
威剛（3260）Dividend Score
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Avg. Yield
4.28%
Avg. Volatility
56.61%
Avg. Filling Rate
75%
Avg. Filling Days
38.13
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.5 | 0 | 0.5 | 1 | 1.18% | 0.97 | -238% |
| 2017 | 4 | 0 | 4 | 3 | 5.65% | 5.92 | 65% |
| 2018 | 6 | 0 | 6 | - | 10.05% | 0.79 | 76% |
| 2019 | 0.2 | 0 | 0.2 | 1 | 0.38% | 1.2 | -24% |
| 2020 | 1.41 | 0 | 1.41 | 2 | 2.41% | 3.32 | 75% |
| 2021 | 3.18 | 0 | 3.18 | 1 | 2.79% | 9.05 | 60% |
| 2022 | 5.43 | 0 | 5.43 | 40 | 9.47% | 1.96 | 63% |
| 2023 | 2 | 0 | 2 | 1 | 2.36% | 1.11 | 64% |
| 2024 | 3 | 0 | 3 | 1 | 2.84% | 6.2 | 0% |
| 2025 | 5.12 | 0 | 5.12 | 22 | 5.72% | 4.49 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2017 Filling Days: 3
$4 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$6 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$0.2 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$1.41 (Incl. Stock Dividend $0)