虹冠電3257.TW AI Analysis
TW StockSemiconductor
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虹冠電（3257）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.65 | 0.09 | 0.73 | 5 | 1.7% | 1.27 | 28% |
| 2017 | 0.65 | 0.07 | 0.71 | 2 | 1.33% | 0.57 | 34% |
| 2018 | 0.5 | 0 | 0.5 | 1 | 0.89% | 1.26 | 49% |
| 2019 | 4 | 0 | 4 | 8 | 7.71% | 0.12 | 92% |
| 2020 | 2.43 | 0.05 | 2.48 | 4 | 3.08% | 1.16 | 72% |
| 2021 | 3 | 0.1 | 3.1 | - | 3.71% | 2.52 | 57% |
| 2022 | 5 | 0 | 5 | - | 7.44% | 0.84 | 90% |
| 2023 | 1 | 0 | 1 | 1 | 1.88% | 0.38 | 71% |
| 2024 | 3 | 0 | 3 | 136 | 4.3% | 0.78 | 96% |
| 2025 | 2 | 0 | 2 | 25 | 3.92% | 0.64 | 82% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 5
$0.65 (Incl. Stock Dividend $0.085)
2017 Filling Days: 2
$0.65 (Incl. Stock Dividend $0.065)
2018 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2019 Filling Days: 8
$4 (Incl. Stock Dividend $0)
2020 Filling Days: 4
$2.43 (Incl. Stock Dividend $0.0486338)
Avg. Yield
3.6%
Avg. Volatility
48.89%
Avg. Filling Rate
86.67%
Avg. Filling Days
27.69
Consequent Years
10