原相3227.TW AI Analysis
TW StockSemiconductor
(No presentation for 3227)
原相(3227)Dividend Score

Browsing restrictions can be lifted for a fee.

Browsing restrictions can be lifted for a fee.
Avg. Yield
4.34%
Avg. Volatility
44.62%
Avg. Filling Rate
100%
Avg. Filling Days
18.25
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.4 | 0 | 2.4 | 106 | 3.38% | 0.42 | 21% |
| 2017 | 2 | 0 | 2 | 1 | 1.7% | 2.13 | 43% |
| 2018 | 4.47 | 0 | 4.47 | 2 | 3.62% | 3.22 | 84% |
| 2019 | 5.27 | 0 | 5.27 | 2 | 4.78% | 1.43 | 84% |
| 2020 | 5.13 | 0 | 5.13 | 1 | 2.41% | 4.01 | 86% |
| 2021 | 8.48 | 0 | 8.48 | 7 | 4.24% | 6.77 | 83% |
| 2022 | 9 | 0 | 9 | 21 | 10.52% | 2.75 | 83% |
| 2023 | 6 | 0 | 6 | 3 | 5.41% | 1.56 | 83% |
| 2024 | 4.52 | 0 | 4.52 | 1 | 2.51% | 2.02 | 84% |
| 2025 | 10 | 0 | 10 | 2 | 4.83% | 6.25 | 82% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 106
$2.4 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$2 (Incl. Stock Dividend $0)
2018 Filling Days: 2
$4.47 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$5.27 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$5.13 (Incl. Stock Dividend $0)