景碩3189.TW AI Analysis
TW StockSemiconductor
(No presentation for 3189)
景碩（3189）Dividend Score
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Avg. Yield
2.94%
Avg. Volatility
62.6%
Avg. Filling Rate
90.48%
Avg. Filling Days
8.58
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3.5 | 0 | 3.5 | 29 | 5.12% | 2.51 | 54% |
| 2017 | 3 | 0 | 3 | 1 | 3.65% | 0.45 | 60% |
| 2018 | 1.5 | 0 | 1.5 | 2 | 3.07% | 0.23 | 136% |
| 2019 | 1.5 | 0 | 1.5 | 5 | 4.11% | -3.91 | 194% |
| 2020 | 1 | 0 | 1 | 1 | 1.45% | 0.7 | -22% |
| 2021 | 1 | 0 | 1 | 1 | 0.58% | 2.47 | 83% |
| 2022 | 4.5 | 0 | 4.5 | - | 3.11% | 8.04 | 53% |
| 2023 | 6.48 | 0 | 6.48 | 3 | 6.05% | 0.06 | 42% |
| 2024 | 1 | 0 | 1 | 3 | 1.06% | 0.25 | 956% |
| 2025 | 1 | 0 | 1 | 1 | 1.21% | 1.35 | 934% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 29
$3.5 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$3 (Incl. Stock Dividend $0)
2018 Filling Days: 2
$1.5 (Incl. Stock Dividend $0)
2019 Filling Days: 5
$1.5 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1 (Incl. Stock Dividend $0)