公準3178.TW AI Analysis
TW StockSemiconductor
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公準（3178）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2019 | 1 | 0 | 1 | 27 | 3.64% | 0.75 | 53% |
| 2020 | 0.7 | 0 | 0.7 | 1 | 1.34% | 1.51 | 57% |
| 2021 | 1.2 | 0 | 1.2 | 1 | 1.91% | 1.51 | 51% |
| 2022 | 1 | 0 | 1 | 2 | 1.56% | 2.71 | 50% |
| 2023 | 2.5 | 0 | 2.5 | 1 | 2.56% | 3.96 | 50% |
| 2024 | 2.25 | 0 | 2.25 | - | 2.6% | 0.7 | 0% |
| 2025 | 0.5 | 0 | 0.5 | 1 | 0.83% | -0.34 | 0% |
Dividend Distribution and Dividend Yield
2019 Filling Days: 27
$1 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$0.7 (Incl. Stock Dividend $0)
2021 Filling Days: 1
$1.2 (Incl. Stock Dividend $0)
2022 Filling Days: 2
$1 (Incl. Stock Dividend $0)
2023 Filling Days: 1
$2.5 (Incl. Stock Dividend $0)
Avg. Yield
2.06%
Avg. Volatility
48.6%
Avg. Filling Rate
85.71%
Avg. Filling Days
5.5
Consequent Years
7