亞信3169.TW AI Analysis
TW StockSemiconductor
(No presentation for 3169)
亞信（3169）Dividend Score
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Avg. Yield
4.44%
Avg. Volatility
37.99%
Avg. Filling Rate
87.5%
Avg. Filling Days
31.57
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.5 | 0 | 1.5 | 11 | 6.25% | 0.49 | 100% |
| 2017 | 1 | 0 | 1 | 23 | 3.66% | 0.9 | 86% |
| 2018 | 1.8 | 0 | 1.8 | 48 | 7.26% | 0.82 | 82% |
| 2019 | 2 | 0 | 2 | 2 | 4.96% | 1.32 | 90% |
| 2020 | 2.1 | 0 | 2.1 | 32 | 5.79% | 1.07 | 81% |
| 2021 | 2.5 | 0 | 2.5 | 1 | 1.79% | 2.35 | 98% |
| 2022 | 5 | 0 | 5 | 2 | 3.82% | 3.6 | 65% |
| 2023 | 5.5 | 0 | 5.5 | 47 | 4.45% | 1.71 | 68% |
| 2024 | 3.5 | 0 | 3.5 | - | 2.68% | 1.8 | 96% |
| 2025 | 3 | 0 | 3 | 1 | 3.77% | 1.81 | 88% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 11
$1.5 (Incl. Stock Dividend $0)
2017 Filling Days: 23
$1 (Incl. Stock Dividend $0)
2018 Filling Days: 48
$1.8 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$2 (Incl. Stock Dividend $0)
2020 Filling Days: 32
$2.1 (Incl. Stock Dividend $0)