晶宏3141.TW AI Analysis
TW StockSemiconductor
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晶宏（3141）Dividend Score
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Avg. Yield
2.01%
Avg. Volatility
46.29%
Avg. Filling Rate
100%
Avg. Filling Days
11.25
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.31 | 0 | 0.31 | 1 | 0.62% | 1.6 | 23% |
| 2017 | 0.57 | 0 | 0.57 | 2 | 1.81% | 0.29 | 25% |
| 2018 | 1 | 0 | 1 | 12 | 2.94% | 1.01 | 71% |
| 2019 | 1.51 | 0 | 1.51 | 34 | 4.49% | 0.7 | 54% |
| 2020 | 0.4 | 0.03 | 0.43 | 6 | 1.61% | 0.53 | 33% |
| 2021 | 0.62 | 0 | 0.62 | 1 | 0.41% | 6.59 | 40% |
| 2022 | 4 | 0 | 4 | 1 | 3.85% | 6.43 | 38% |
| 2023 | 2.67 | 0 | 2.67 | 68 | 2.76% | 0.93 | 39% |
| 2024 | 0.51 | 0 | 0.51 | 1 | 0.58% | 0.92 | 0% |
| 2025 | 0.51 | 0 | 0.51 | 1 | 1.04% | -0.32 | 44% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.31 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$0.57 (Incl. Stock Dividend $0)
2018 Filling Days: 12
$1 (Incl. Stock Dividend $0)
2019 Filling Days: 34
$1.51 (Incl. Stock Dividend $0)
2020 Filling Days: 6
$0.4 (Incl. Stock Dividend $0.0250323)