笙泉3122.TW AI Analysis
TW StockSemiconductor
(No presentation for 3122)
笙泉（3122）Dividend Score
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Avg. Yield
1.66%
Avg. Volatility
52.21%
Avg. Filling Rate
100%
Avg. Filling Days
33.83
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.78 | 0 | 0.78 | 1 | 4.53% | 0.51 | 77% |
| 2017 | 0.51 | 0 | 0.51 | 33 | 3.39% | -0.13 | 76% |
| 2018 | 0.2 | 0 | 0.2 | 3 | 1.19% | -0.2 | -50% |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 2.15 | 0 | 2.15 | 5 | 6.57% | 1.03 | 65% |
| 2023 | 0.24 | 0 | 0.24 | 1 | 0.92% | -0.97 | 54% |
| 2024 | 0 | 0 | 0 | - | 0% | 0 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.78 (Incl. Stock Dividend $0)
2017 Filling Days: 33
$0.51 (Incl. Stock Dividend $0)
2018 Filling Days: 3
$0.2 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)