聯傑3094.TW AI Analysis
TW StockSemiconductor
(No presentation for 3094)
聯傑(3094)Dividend Score

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Avg. Yield
3.42%
Avg. Volatility
40.27%
Avg. Filling Rate
100%
Avg. Filling Days
20.05
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.16 | 0 | 1.16 | 11 | 5.45% | 0.43 | 87% |
| 2017 | 1.1 | 0 | 1.1 | 97 | 4.49% | 0.31 | 90% |
| 2018 | 0.9 | 0 | 0.9 | 8 | 3.9% | 0.24 | 87% |
| 2019 | 0.8 | 0 | 0.8 | 16 | 4.65% | 0.19 | 88% |
| 2020 | 0.82 | 0 | 0.82 | 40 | 4.01% | 0.23 | 92% |
| 2021 | 0.8 | 0 | 0.8 | 1 | 2.32% | 0.38 | 88% |
| 2022 | 0.99 | 0 | 0.99 | 2 | 3.7% | 0.47 | 57% |
| 2023 | 1 | 0 | 1 | 46 | 3.02% | 0.42 | 90% |
| 2024 | 0.61 | 0 | 0.61 | 3 | 1.97% | 0.06 | 90% |
| 2025 | 0.17 | 0 | 0.17 | 6 | 0.66% | 0.01 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 11
$1.16 (Incl. Stock Dividend $0)
2017 Filling Days: 97
$1.1 (Incl. Stock Dividend $0)
2018 Filling Days: 8
$0.9 (Incl. Stock Dividend $0)
2019 Filling Days: 16
$0.8 (Incl. Stock Dividend $0)
2020 Filling Days: 40
$0.82 (Incl. Stock Dividend $0)