日電貿3090.TW AI Analysis
TW Stock
(No presentation for 3090)
日電貿（3090）Dividend Score
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Avg. Yield
7.43%
Avg. Volatility
43.36%
Avg. Filling Rate
68.18%
Avg. Filling Days
77.27
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2 | 0 | 2 | 46 | 8.95% | 1.08 | 88% |
| 2017 | 2 | 0 | 2 | 91 | 7.16% | 1.39 | 86% |
| 2018 | 2.5 | 0.07 | 2.57 | - | 3.36% | 4.73 | 72% |
| 2019 | 6.5 | 0 | 6.5 | - | 12.08% | 1.68 | 76% |
| 2020 | 3.5 | 0 | 3.5 | 152 | 6.93% | 1.69 | 105% |
| 2021 | 3.1 | 0 | 3.1 | 83 | 5.76% | 2.53 | 92% |
| 2022 | 4 | 0 | 4 | 28 | 8.97% | 3 | 87% |
| 2023 | 5.5 | 0 | 5.5 | 50 | 10.22% | 1.61 | 79% |
| 2024 | 3.4 | 0 | 3.4 | 94 | 5.24% | 2.3 | 102% |
| 2025 | 4.2 | 0 | 4.2 | 10 | 5.59% | 2.23 | 94% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 46
$2 (Incl. Stock Dividend $0)
2017 Filling Days: 91
$2 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$2.5 (Incl. Stock Dividend $0.07)
2019 Filling Days: 0
$6.5 (Incl. Stock Dividend $0)
2020 Filling Days: 152
$3.5 (Incl. Stock Dividend $0)