智原3035.TW AI Analysis
TW StockSemiconductor
(No presentation for 3035)
智原（3035）Dividend Score
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Avg. Yield
2.59%
Avg. Volatility
45.06%
Avg. Filling Rate
88.46%
Avg. Filling Days
23.26
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2 | 0 | 2 | 127 | 6.17% | 0.81 | 107% |
| 2017 | 1 | 0 | 1 | 5 | 2.3% | 2.73 | 87% |
| 2018 | 2.7 | 0 | 2.7 | 4 | 4.59% | 0.39 | 80% |
| 2019 | 0.8 | 0 | 0.8 | 3 | 1.49% | 0.61 | 19% |
| 2020 | 1.1 | 0 | 1.1 | 1 | 2.36% | 0.74 | 79% |
| 2021 | 1 | 0 | 1 | 1 | 0.83% | 1.41 | 93% |
| 2022 | 3.3 | 0 | 3.3 | 1 | 2.3% | 5.36 | 71% |
| 2023 | 5 | 0 | 5 | 1 | 2.76% | 3.68 | 51% |
| 2024 | 4.29 | 0 | 4.29 | 1 | 1.39% | 2.12 | 70% |
| 2025 | 3 | 0 | 3 | 1 | 1.7% | 1.43 | 75% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 127
$2 (Incl. Stock Dividend $0)
2017 Filling Days: 5
$1 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$2.7 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$0.8 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1.1 (Incl. Stock Dividend $0)