聯詠3034.TW AI Analysis
TW StockSemiconductor
(No presentation for 3034)
聯詠（3034）Dividend Score
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Avg. Yield
7.24%
Avg. Volatility
26.71%
Avg. Filling Rate
92%
Avg. Filling Days
58.91
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 9 | 0 | 9 | 200 | 7.66% | 4.14 | 86% |
| 2017 | 7 | 0 | 7 | 8 | 6.03% | 3.54 | 85% |
| 2018 | 7.1 | 0 | 7.1 | 4 | 5.4% | 4.11 | 86% |
| 2019 | 8.8 | 0 | 8.8 | 3 | 5.05% | 6.73 | 84% |
| 2020 | 10.5 | 0 | 10.5 | 12 | 3.82% | 7.84 | 69% |
| 2021 | 15.6 | 0 | 15.6 | 78 | 3.18% | 25.74 | 80% |
| 2022 | 51.5 | 0 | 51.5 | 87 | 20.68% | 32.25 | 81% |
| 2023 | 37 | 0 | 37 | 15 | 9.4% | 19.1 | 81% |
| 2024 | 32 | 0 | 32 | - | 5.59% | 16.9 | 0% |
| 2025 | 28 | 0 | 28 | - | 5.53% | 14.8 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 200
$9 (Incl. Stock Dividend $0)
2017 Filling Days: 8
$7 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$7.1 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$8.8 (Incl. Stock Dividend $0)
2020 Filling Days: 12
$10.5 (Incl. Stock Dividend $0)