嘉晶3016.TW AI Analysis
TW StockSemiconductor
(No presentation for 3016)
嘉晶(3016)Dividend Score

Browsing restrictions can be lifted for a fee.

Browsing restrictions can be lifted for a fee.
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0.5 | 0 | 0.5 | 1 | 0.7% | 0.67 | 76% |
| 2019 | 1 | 0 | 1 | 16 | 2.2% | 0.11 | 64% |
| 2020 | 0.25 | 0 | 0.25 | 2 | 0.34% | 0.16 | 655% |
| 2021 | 0.25 | 0 | 0.25 | 1 | 0.3% | 0.49 | 272% |
| 2022 | 1.18 | 0 | 1.18 | 1 | 1.51% | 1.38 | 90% |
| 2023 | 2 | 0 | 2 | 1 | 3.16% | 0.27 | 85% |
| 2024 | 0.5 | 0 | 0.5 | 1 | 0.75% | 0.66 | 88% |
| 2025 | 0.5 | 0 | 0.5 | 1 | 1.61% | -0.14 | 55% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2019 Filling Days: 16
$1 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$0.25 (Incl. Stock Dividend $0)
Avg. Yield
1.06%
Avg. Volatility
61.02%
Avg. Filling Rate
93.33%
Avg. Filling Days
2.14
Consequent Years
8