聯陽3014.TW AI Analysis
TW StockSemiconductor
(No presentation for 3014)
聯陽（3014）Dividend Score
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Avg. Yield
7.18%
Avg. Volatility
29.54%
Avg. Filling Rate
81.82%
Avg. Filling Days
18.06
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2 | 0 | 2 | 3 | 7.35% | 1.07 | 91% |
| 2017 | 2.93 | 0 | 2.93 | 68 | 8.68% | 1.16 | 100% |
| 2018 | 2.5 | 0 | 2.5 | - | 7.25% | 1.42 | 87% |
| 2019 | 2.7 | 0 | 2.7 | 38 | 8.01% | 1.41 | 73% |
| 2020 | 3.3 | 0 | 3.3 | 19 | 4.63% | 2.26 | 90% |
| 2021 | 6 | 0 | 6 | - | 5.17% | 5.21 | 95% |
| 2022 | 9 | 0 | 9 | 105 | 13.7% | 4.34 | 71% |
| 2023 | 6 | 0 | 6 | 13 | 5.22% | 4.84 | 73% |
| 2024 | 8 | 0 | 8 | - | 4.73% | 4.96 | 76% |
| 2025 | 9 | 0 | 9 | 28 | 7.03% | 5.19 | 87% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 3
$2 (Incl. Stock Dividend $0)
2017 Filling Days: 68
$2.93 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$2.5 (Incl. Stock Dividend $0)
2019 Filling Days: 38
$2.7 (Incl. Stock Dividend $0)
2020 Filling Days: 19
$3.3 (Incl. Stock Dividend $0)