晶豪科3006.TW AI Analysis
TW StockSemiconductor
(No presentation for 3006)
晶豪科（3006）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.16 | 0 | 1.16 | 9 | 4.08% | 1.12 | 56% |
| 2017 | 1.43 | 0 | 1.43 | 9 | 4.03% | 1.55 | 38% |
| 2018 | 2.24 | 0 | 2.24 | 11 | 6.02% | 1.67 | 66% |
| 2019 | 1.5 | 0 | 1.5 | 7 | 4.87% | 0.73 | 61% |
| 2020 | 1 | 0 | 1 | 2 | 2.55% | 2.11 | 57% |
| 2021 | 2 | 0 | 2 | 1 | 1.09% | 6.92 | 53% |
| 2022 | 8 | 0 | 8 | 15 | 9.9% | 6.76 | 46% |
| 2023 | 1.8 | 0 | 1.8 | 1 | 2.26% | -1.68 | 49% |
| 2024 | 0.6 | 0 | 0.6 | 1 | 0.59% | 0.67 | -14% |
| 2025 | 1 | 0 | 1 | 1 | 2.03% | -2.86 | 57% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 9
$1.16 (Incl. Stock Dividend $0)
2017 Filling Days: 9
$1.43 (Incl. Stock Dividend $0)
2018 Filling Days: 11
$2.24 (Incl. Stock Dividend $0)
2019 Filling Days: 7
$1.5 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$1 (Incl. Stock Dividend $0)
Avg. Yield
3.74%
Avg. Volatility
63.31%
Avg. Filling Rate
75%
Avg. Filling Days
22.06
Consequent Years
10