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資通2471.TW AI Analysis

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資通(2471)Dividend Score

Oriented Analysis

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資通(2471)Dividend Reference Factor

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Avg. Yield

7.4%

Avg. Volatility

33.67%

Avg. Filling Rate

76.19%

Avg. Filling Days

47.38

Consequent Years

10

Historical Dividend Policy

YearCash DividendStock DividendTotalFilling DaysDividend YieldEPSPayout Ratio
20161.0401.041197.48%0.1172%
20171.3401.34-8.43%-0.1378%
2018101266.87%0.3390%
20191.201.2226.88%0.7693%
20201.4201.42766.6%0.1684%
20211.501.5566.41%-0.0773%
20222.2402.24168.71%1.1793%
20232.8302.8355.33%1.9393%
20246.5706.579211.51%1.1190%
20253.0603.06-5.72%0.3992%

Dividend Distribution and Dividend Yield

2016 Filling Days: 119

$1.04 (Incl. Stock Dividend $0)

7.48%

2017 Filling Days: 0

$1.34 (Incl. Stock Dividend $0)

8.43%

2018 Filling Days: 26

$1 (Incl. Stock Dividend $0)

6.87%

2019 Filling Days: 22

$1.2 (Incl. Stock Dividend $0)

6.88%

2020 Filling Days: 76

$1.42 (Incl. Stock Dividend $0)

6.6%