義隆2458.TW AI Analysis
TW StockSemiconductor
(No presentation for 2458)
2458 Dividend Score
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2458 Dividend Reference Factor
Avg. Yield
6.35%
Avg. Volatility
34.88%
Avg. Filling Rate
92.59%
Avg. Filling Days
25.4
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.03 | 0 | 2.03 | 141 | 5.2% | 1.18 | 85% |
| 2017 | 1.57 | 0 | 1.57 | 33 | 3.51% | 1.04 | 66% |
| 2018 | 2.58 | 0 | 2.58 | 14 | 5.43% | 1.54 | 93% |
| 2019 | 5 | 0 | 5 | 6 | 6.71% | 2.85 | 91% |
| 2020 | 6.5 | 0 | 6.5 | 5 | 5.42% | 3.33 | 79% |
| 2021 | 9 | 0 | 9 | 4 | 4.89% | 8.3 | 84% |
| 2022 | 13.81 | 0 | 13.81 | - | 13.01% | 5.56 | 80% |
| 2023 | 6.14 | 0 | 6.14 | 3 | 5.61% | 1.95 | 85% |
| 2024 | 5.1 | 0 | 5.1 | 9 | 3.39% | 3.96 | 78% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 141
$2.03 (Incl. Stock Dividend $0)
2017 Filling Days: 33
$1.57 (Incl. Stock Dividend $0)
2018 Filling Days: 14
$2.58 (Incl. Stock Dividend $0)
2019 Filling Days: 6
$5 (Incl. Stock Dividend $0)
2020 Filling Days: 5
$6.5 (Incl. Stock Dividend $0)