聯發科2454.TW AI Analysis
TW StockSemiconductor
(No presentation for 2454)
聯發科（2454）Dividend Score
Browsing restrictions can be lifted for a fee.
Join Growin Stock Community!
Browsing restrictions can be lifted for a fee.
Avg. Yield
5.03%
Avg. Volatility
39.79%
Avg. Filling Rate
82.14%
Avg. Filling Days
29.57
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 11 | 0 | 11 | 9 | 4.68% | 6.95 | 67% |
| 2017 | 9.5 | 0 | 9.5 | 16 | 3.72% | 5.8 | 53% |
| 2018 | 10 | 0 | 10 | 4 | 3.64% | 6.33 | 49% |
| 2019 | 9 | 0 | 9 | 4 | 2.88% | 6.28 | 46% |
| 2020 | 10.5 | 0 | 10.5 | 1 | 1.83% | 8.22 | 34% |
| 2021 | 37 | 0 | 37 | 9 | 4.02% | 33.65 | 82% |
| 2022 | 73 | 0 | 73 | - | 9.95% | 43.4 | 82% |
| 2023 | 76.01 | 0 | 76.01 | 62 | 10.72% | 20.71 | 84% |
| 2024 | 55.01 | 0 | 55.01 | 11 | 4.78% | 34.18 | 114% |
| 2025 | 54 | 0 | 54 | 2 | 4.07% | 51.42 | 81% |
| 2026 | 29 | 0 | 29 | - | 1.94% | 66.16 | 81% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 9
$11 (Incl. Stock Dividend $0)
2017 Filling Days: 16
$9.5 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$10 (Incl. Stock Dividend $0)
2019 Filling Days: 4
$9 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$10.5 (Incl. Stock Dividend $0)