超豐2441.TW AI Analysis
TW StockSemiconductor
(No presentation for 2441)
超豐（2441）Dividend Score
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Avg. Yield
5.69%
Avg. Volatility
38.34%
Avg. Filling Rate
84%
Avg. Filling Days
44
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.4 | 0 | 2.4 | 27 | 6.25% | 1.87 | 49% |
| 2017 | 2.75 | 0 | 2.75 | 13 | 5.74% | 2.09 | 70% |
| 2018 | 3 | 0 | 3 | - | 5.95% | 2.23 | 68% |
| 2019 | 2.7 | 0 | 2.7 | 18 | 6.63% | 1.45 | 65% |
| 2020 | 2.3 | 0 | 2.3 | 7 | 4.55% | 2.11 | 69% |
| 2021 | 3.1 | 0 | 3.1 | 5 | 3.53% | 3.63 | 66% |
| 2022 | 5 | 0 | 5 | - | 8.29% | 3.97 | 62% |
| 2023 | 3.7 | 0 | 3.7 | 4 | 6.63% | 1.67 | 67% |
| 2024 | 2.5 | 0 | 2.5 | 105 | 4.15% | 2.19 | 71% |
| 2025 | 3 | 0 | 3 | 6 | 5.22% | 1.88 | 68% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 27
$2.4 (Incl. Stock Dividend $0)
2017 Filling Days: 13
$2.75 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$3 (Incl. Stock Dividend $0)
2019 Filling Days: 18
$2.7 (Incl. Stock Dividend $0)
2020 Filling Days: 7
$2.3 (Incl. Stock Dividend $0)