南亞科2408.TW AI Analysis
TW StockSemiconductor
(No presentation for 2408)
南亞科（2408）Dividend Score
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Avg. Yield
4.12%
Avg. Volatility
73.16%
Avg. Filling Rate
92.31%
Avg. Filling Days
12.5
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.8 | 0 | 2.8 | 4 | 7.55% | 0.82 | 45% |
| 2017 | 1.5 | 0 | 1.5 | 5 | 2.87% | 3.55 | 17% |
| 2018 | 3.51 | 0 | 3.51 | 12 | 4.19% | 6.07 | 27% |
| 2019 | 7.11 | 0 | 7.11 | 6 | 12.24% | 2.09 | 55% |
| 2020 | 1.5 | 0 | 1.5 | 6 | 2.52% | 1.68 | 47% |
| 2021 | 1.3 | 0 | 1.3 | 1 | 1.75% | 2.88 | 52% |
| 2022 | 3.7 | 0 | 3.7 | 81 | 6.94% | 4.24 | 50% |
| 2023 | 2.13 | 0 | 2.13 | 1 | 3.1% | -0.79 | 45% |
| 2024 | 0 | 0 | 0 | - | 0% | 0 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 4
$2.8 (Incl. Stock Dividend $0)
2017 Filling Days: 5
$1.5 (Incl. Stock Dividend $0)
2018 Filling Days: 12
$3.51 (Incl. Stock Dividend $0)
2019 Filling Days: 6
$7.11 (Incl. Stock Dividend $0)
2020 Filling Days: 6
$1.5 (Incl. Stock Dividend $0)