瑞昱2379.TW AI Analysis
TW StockSemiconductor
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瑞昱（2379）Dividend Score
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Avg. Yield
4.39%
Avg. Volatility
31.85%
Avg. Filling Rate
89.29%
Avg. Filling Days
48.16
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 4 | 0 | 4 | - | 3.25% | 3.19 | 62% |
| 2017 | 5 | 0 | 5 | 38 | 4.52% | 5.14 | 66% |
| 2018 | 5.5 | 0 | 5.5 | 61 | 3.82% | 6.41 | 67% |
| 2019 | 7 | 0 | 7 | 8 | 3.29% | 10.13 | 70% |
| 2020 | 11 | 0 | 11 | 1 | 2.97% | 12.1 | 68% |
| 2021 | 14 | 0 | 14 | 47 | 2.63% | 23.98 | 70% |
| 2022 | 27 | 0 | 27 | 52 | 8.87% | 27.47 | 76% |
| 2023 | 27 | 0 | 27 | 52 | 6.45% | 13.59 | 82% |
| 2024 | 15.5 | 0 | 15.5 | 2 | 3.13% | 23.19 | 0% |
| 2025 | 25.5 | 0 | 25.5 | 5 | 4.96% | 23.59 | 86% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$4 (Incl. Stock Dividend $0)
2017 Filling Days: 38
$5 (Incl. Stock Dividend $0)
2018 Filling Days: 61
$5.5 (Incl. Stock Dividend $0)
2019 Filling Days: 8
$7 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$11 (Incl. Stock Dividend $0)