菱生2369.TW AI Analysis
TW StockSemiconductor
(No presentation for 2369)
菱生（2369）Dividend Score
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Avg. Yield
2.67%
Avg. Volatility
49.09%
Avg. Filling Rate
87.5%
Avg. Filling Days
33.48
Consequent Years
4
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.26 | 0 | 0.26 | 8 | 3.1% | 0.09 | 0% |
| 2017 | 0.5 | 0 | 0.5 | 14 | 3.41% | 0.2 | 82% |
| 2018 | 0.5 | 0 | 0.5 | - | 4.31% | -0.21 | 145% |
| 2019 | 0.2 | 0 | 0.2 | 2 | 2.44% | -0.95 | 0% |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 1.29 | 0 | 1.29 | 12 | 8.42% | 0.61 | 56% |
| 2023 | 0.3 | 0 | 0.3 | 1 | 1.52% | -0.24 | 55% |
| 2024 | 0.3 | 0 | 0.3 | 1 | 1.46% | 0.02 | 0% |
| 2025 | 0.3 | 0 | 0.3 | 2 | 2.06% | -0.66 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 8
$0.26 (Incl. Stock Dividend $0)
2017 Filling Days: 14
$0.5 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0.5 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$0.2 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)