矽統2363.TW AI Analysis
TW StockSemiconductor
(No presentation for 2363)
矽統（2363）Dividend Score
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Avg. Yield
1.73%
Avg. Volatility
47.11%
Avg. Filling Rate
86.67%
Avg. Filling Days
3.23
Consequent Years
6
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0.35 | 0.14 | 0.49 | 11 | 3.14% | -0.24 | -86% |
| 2021 | 0.8 | 0.08 | 0.88 | 3 | 3.2% | -0.24 | -169% |
| 2022 | 0.8 | 0.1 | 0.9 | - | 3.84% | 1 | 275% |
| 2023 | 1 | 0 | 1 | 8 | 5.7% | 1.03 | 155% |
| 2024 | 0.3 | 0 | 0.3 | 1 | 0.53% | 0.91 | 155% |
| 2025 | 0.5 | 0 | 0.5 | 1 | 0.91% | 1.2 | 52% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 11
$0.35 (Incl. Stock Dividend $0.1388)