華碩2357.TW AI Analysis
TW StockComputer & Periphera
(No presentation for 2357)
華碩（2357）Dividend Score
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Avg. Yield
6.77%
Avg. Volatility
38.22%
Avg. Filling Rate
75.86%
Avg. Filling Days
61.23
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 15 | 0 | 15 | 37 | 5.61% | 11.16 | 65% |
| 2017 | 17 | 0 | 17 | 101 | 6.45% | 7.62 | 66% |
| 2018 | 15 | 0 | 15 | - | 5.81% | 5 | 72% |
| 2019 | 15 | 0 | 15 | 92 | 6.91% | 5.21 | 263% |
| 2020 | 14 | 0 | 14 | 36 | 6.02% | 8.35 | 86% |
| 2021 | 26 | 0 | 26 | 56 | 8% | 28.49 | 73% |
| 2022 | 42 | 0 | 42 | 210 | 15.16% | 16.59 | 70% |
| 2023 | 15 | 0 | 15 | 11 | 5.04% | 1.22 | 76% |
| 2024 | 17 | 0 | 17 | 2 | 3.59% | 23.23 | 79% |
| 2025 | 34 | 0 | 34 | 56 | 5.11% | 30.42 | 80% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 37
$15 (Incl. Stock Dividend $0)
2017 Filling Days: 101
$17 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$15 (Incl. Stock Dividend $0)
2019 Filling Days: 92
$15 (Incl. Stock Dividend $0)
2020 Filling Days: 36
$14 (Incl. Stock Dividend $0)