華邦電2344.TW AI Analysis
TW StockSemiconductor
(No presentation for 2344)
華邦電（2344）Dividend Score
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Avg. Yield
2.54%
Avg. Volatility
68.51%
Avg. Filling Rate
71.43%
Avg. Filling Days
24
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.1 | 0 | 0.1 | 1 | 1.02% | 0.4 | 11% |
| 2017 | 0.6 | 0 | 0.6 | 4 | 3.41% | 0.47 | 74% |
| 2018 | 1 | 0 | 1 | - | 5.71% | 0.94 | 72% |
| 2019 | 1 | 0 | 1 | 2 | 6.31% | 0.22 | 53% |
| 2020 | 0.1 | 0 | 0.1 | 1 | 0.74% | 0.16 | 32% |
| 2021 | 0.2 | 0 | 0.2 | 1 | 0.57% | 1.24 | 61% |
| 2022 | 1 | 0 | 1 | 194 | 3.87% | 2.44 | 29% |
| 2023 | 1 | 0 | 1 | 13 | 3.72% | -0.19 | 31% |
| 2024 | 0 | 0 | 0 | - | 0% | 0 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.1 (Incl. Stock Dividend $0)
2017 Filling Days: 4
$0.6 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$1 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$1 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$0.1 (Incl. Stock Dividend $0)