茂矽2342.TW AI Analysis
TW StockSemiconductor
(No presentation for 2342)
茂矽（2342）Dividend Score
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Avg. Yield
1.02%
Avg. Volatility
55.58%
Avg. Filling Rate
78.57%
Avg. Filling Days
56.64
Consequent Years
1
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0.27 | 0 | 0.27 | 1 | 1.28% | -1.67 | 24% |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0.5 | 0 | 0.5 | 21 | 1.07% | 1.04 | 0% |
| 2022 | 0.5 | 0 | 0.5 | 2 | 1.36% | 1.93 | 32% |
| 2023 | 2 | 0 | 2 | 1 | 5.03% | 1.63 | 57% |
| 2024 | 0 | 0 | 0 | - | 0% | - | - |
| 2025 | 0.3 | 0 | 0.3 | 5 | 1.41% | -0.2 | 52% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$0.27 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)