台亞2340.TW AI Analysis
TW StockSemiconductor
(No presentation for 2340)
台亞（2340）Dividend Score
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Avg. Yield
3.91%
Avg. Volatility
50.45%
Avg. Filling Rate
91.3%
Avg. Filling Days
49
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1 | 0 | 1 | 7 | 8.55% | 0.72 | 95% |
| 2017 | 1.19 | 0 | 1.19 | 34 | 7.15% | 0.65 | 77% |
| 2018 | 1.35 | 0 | 1.35 | 6 | 5.24% | 0.7 | 89% |
| 2019 | 0.5 | 0 | 0.5 | 1 | 2.43% | 0.59 | 34% |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 1.39 | 0 | 1.39 | 6 | 5.56% | 1.16 | 90% |
| 2022 | 3 | 0 | 3 | 224 | 7.25% | 0.63 | 159% |
| 2023 | 1 | 0 | 1 | 1 | 1.78% | 0.42 | 122% |
| 2024 | 0.5 | 0 | 0.5 | 1 | 1.17% | -0.21 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 7
$1 (Incl. Stock Dividend $0)
2017 Filling Days: 34
$1.19 (Incl. Stock Dividend $0)
2018 Filling Days: 6
$1.35 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)