旺宏2337.TW AI Analysis
TW StockSemiconductor
(No presentation for 2337)
旺宏（2337）Dividend Score
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Avg. Yield
2.82%
Avg. Volatility
65.63%
Avg. Filling Rate
76.19%
Avg. Filling Days
38.88
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 1 | 0.02 | 1.02 | 4 | 3.16% | 2.36 | 33% |
| 2019 | 1.2 | 0 | 1.2 | 3 | 4.43% | 0.22 | 25% |
| 2020 | 1.19 | 0 | 1.19 | 32 | 3.79% | 1.39 | 73% |
| 2021 | 1.2 | 0 | 1.2 | 42 | 2.98% | 4.48 | 42% |
| 2022 | 1.8 | 0 | 1.8 | 1 | 6.55% | 3.17 | 28% |
| 2023 | 1.8 | 0 | 1.8 | 49 | 5.44% | -0.15 | 37% |
| 2024 | 0.5 | 0 | 0.5 | 9 | 1.86% | -0.74 | 37% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$1 (Incl. Stock Dividend $0.0200058)
2019 Filling Days: 3
$1.2 (Incl. Stock Dividend $0)
2020 Filling Days: 32
$1.19 (Incl. Stock Dividend $0)